Program Committee
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Simon Baker, Carnegie Mellon University,
USA |
Bir Bhanu,
University of California Riverside, USA |
Zhaoqi Bian,
Tsinghua University, China |
Josef Bigun,
Halmstad Univ. and Chalmers Univ.of Tech., Sweden |
Wageeh W
Boles, Queensland University of Technology, Australia |
Ruud (Rudolf)
M. Bolle, IBM T. J. Watson Research Center, USA |
Manfred U.
A. Bromba, Bromba GmbH, Biometrics, Germany, |
Keith Chan,
Hong Kong Polytechnic University, HK |
Ke Chen,
UMIST, UK |
RI Damper,
University of Southampton, UK |
Kenneth Dong,
ID One Inc., USA |
Michael Fairhurst,
University of Kent, UK |
Srinivas
Gutta, Philips, USA |
Wen Gao,
Chinese Academy of Sciences, China |
Lin Hong,
Identix Incorporation, USA |
Wen Hsing
Hsu, National Tsing Hua University, TW |
Behrooz Kamgar-Parsi,
Naval Research Lab., USA |
Mohamed Kamel,
University of Waterloo, Canada |
Bernhard
Kaemmerer, Siemens, Germany |
Daijin Kim,
Pohang University of Science and Technology, Korea |
Jaihie Kim, Yonsei University, Korea |
Josef Kittler,
University of Surrey, UK |
Naohisa Komatsu,
Waseda University, Japan |
Alex Kot,
Nanyang Technological University, Singapore |
Kin
Man Lam, Hong Kong Polytechnic University |
Julia Langenbach,
Delphi Automotive Systems, Germany |
Seong-Whan Lee, Korea University, Korea |
Lei Li, Hosei
University, Japan |
Stan Li,
Microsoft Research Asia, China |
Xiaobo Li,
University of Alberta, Canada |
Ze-Nian Li,
Simon Frason University, Canada |
Lee Luan
Ling, State University of Campinas, Brazil |
Zhiqiang
Liu, City University of Hong Kong, HK |
Javier Ortega-Garcia,
Universidad Politecnica de Madrid, Spain |
Edwige Pissaloux,
Universite de Rouen, France |
Salil Prabhakar,
DigitalPersona Inc., USA |
K. Prasad,
Ford Motor Co., USA |
James Reisman,
Siemens Corporate Research, Inc., USA |
Gerhard Rigoll,
Munich University of Technology, Germany |
Arun Ross,
West Virginia University, USA |
Pat Sankar,
Printrak, USA |
Ulf Cahn
Von Seelen, Iridian Technologies, USA |
Dale Setlak,
AuhenTec Inc., USA |
Pengfei Shi,
Shanghai Jiao Tong University, China |
Kazuhiko
Sumi, Mitsubishi Electric Corporation, Japan |
Eng Chong
Tan, Nanyang Technological University, Singapore |
Michael Thieme,
International Biometric Group, USA |
Pauli Tikkanen,
Nokia, Finland |
Massimo Tistarelli,
Universita` di Sassari, Italy |
Matthew
Turk, University of California, Santa Barbara, USA |
Kaoru Uchida,
NEC Corporation, Japan |
Ajay
Kumar, Hong Kong Polytechnic University, HK |
Claus Vielhauer,
Magdeburg University, Germany |
Harry Wechsler,
George Mason University, USA |
Hong Yan,
City University of Hong Kong, HK |
Dit-Yan Yeung,
Hong Kong University of Science and Tech., HK |
Pong Chin
Yuen, Hong Kong Baptist University |
Michael T.
Yura, West Virginia University, USA |
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